SÜSS MicroTec (SMHN) investor relations material

Company profile and strategic positioning

• Headquartered in Germany with a 75-year history of innovation, serving the global semiconductor industry, especially in Asia.

• Acts as a key technology provider for both frontend and advanced backend semiconductor processes.

• Maintains strong partnerships with global IDMs, foundries, and research institutions.

• Management board oversees finance, sales, R&D, production, and ESG initiatives.

Product portfolio and innovation

• Offers solutions in photomask equipment, imaging, coating, and bonding for both frontend and backend segments.

• Market leader in temporary and hybrid wafer bonding, with recent launches targeting high-volume manufacturing and R&D.

• Upcoming product introductions include advanced photomask cleaning, hybrid bonding, and inkjet coating platforms.

• Focused on supporting next-generation semiconductor nodes and advanced packaging technologies.

Financial performance and outlook

• Q1 2026 order intake reached €149.3m (+69.5% YoY), but sales declined 30.7% YoY to €86.5m.

• Gross profit margin for Q1 2026 was 36.1%, with EBIT margin at 4.3%, both down from prior year due to lower cost coverage.

• 2026 is expected to be a transition year with sales guidance of €425–485m, gross margin 35–37%, and EBIT margin 8–10%.

• Long-term ambitions for 2030 include sales of €750–900m, gross margin 43–45%, and EBIT margin 20–22%.