LPKF Laser & Electronics (LPK) investor relations material

Strategic direction and market positioning

• Focus on expanding from niche markets to larger, high-potential sectors, especially advanced packaging in the semiconductor industry.

• Holds leading positions in laser processing and microsystems technology, enabling key production and R&D processes for customers in over 60 countries.

• Maintains #1 market share in glass processing equipment for the semiconductor value chain, with 80% share in advanced packaging (excluding local China), and aims to capture 70% of the expanding glass substrate market.

• Actively broadening its process portfolio to maintain strategic relevance, including glass singulation, laser bonding, and co-packaged optics.

• Strategic roadmap targets ramp-up of advanced packaging and co-packaged optics from 2027, aiming for high-volume production by 2030.

Technology innovation and industry impact

• Developed the LIDE process, enabling precise, high-volume, crack-free glass structuring for advanced chip packaging.

• Glass substrates offer superior mechanical and dielectric properties, enabling higher chip performance and lower energy consumption.

• Early adoption by over 80% of players making equipment decisions in the glass substrate field.

• Ongoing efforts to defend IP, especially in markets like China, to protect significant R&D investments.

• Preparing for future trends such as Co-Packaged Optics, positioning to lead in optical data communication within chip packages.

Market trends and industry developments

• Semiconductor industry is shifting toward glass-based substrates and through-glass vias, with major players like Intel, Samsung, and TSMC investing in commercialization.

• Glass substrates offer superior performance, cost, and scalability for AI and HPC chips, with industry-wide pilot lines and joint ventures underway.

• Perovskite tandem solar modules are emerging as a next-generation solution, with global PV production reaching 700 GWp in 2024.

• Solar market remains niche but presents new opportunities as perovskite technology matures.

• Laser welding and depaneling technologies are expanding into new applications, including automotive, medical, and consumer sectors.