Nova (NVMI) Bank of America 2026 Global Technology Conference summary

Strategic positioning and growth drivers

• Focus on organic growth and targeted acquisitions to expand product lines and market reach.

• Investment of about 15% of revenue in R&D to maintain technological leadership.

• Differentiation through innovation, superior cost of ownership, and unique metrology solutions.

• Expansion into advanced packaging, now over 20% of business, with strong growth in logic and high-bandwidth memory.

• Recent acquisitions, such as Sentronix, have doubled capacity and driven double-digit growth.

Market outlook and segment opportunities

• Advanced logic, especially gate-all-around, is a key growth area with established positions across all major players.

• DRAM exposure increased from 25% to over 30% in Q1, driven by material and chemical metrology.

• 3D NAND currently muted but seen as a future growth driver as new investments come online.

• Advanced packaging expected to see further adoption of dimensional, chemical, and material metrology.

• Hybrid bonding and new architectures in advanced packaging present significant upcoming opportunities.

Capacity expansion and operational agility

• Capacity doubled globally in 2024–2025 to support customer demand and maintain lead times.

• New production center in Asia to enhance supply chain agility and proximity to customers by 2027.

• German facility capacity doubled post-acquisition, supporting European demand.

• Ongoing investments in supply chain visibility and operational flexibility.