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Hua Hong Semiconductor (1347) Q2 2026 earnings summary

Event summary combining transcript, slides, and related documents.

Logotype for Hua Hong Semiconductor Limited

Q2 2026 earnings summary

13 Aug, 2026

Executive summary

  • Q2 2026 revenue reached a record $717.5 million, up 26.8% year-over-year and 8.6% sequentially, driven by higher wafer shipments, improved ASPs, and strong demand, especially in AI-related applications.

  • Gross margin improved to 16.5%, up 5.6 percentage points year-over-year and 3.5 points sequentially, reflecting pricing and cost reduction efforts.

  • Net profit attributable to shareholders was $38.6 million, a 385.9% increase year-over-year and 84.6% above Q1 2026, reversing prior losses.

  • High fab utilization and growth across all process technology platforms, particularly in non-volatile memory products.

  • Regulatory approval for the acquisition of Huali Microelectronics, expected to enhance technology portfolio, scale, and profitability.

Financial highlights

  • Revenue: $717.5 million, up 26.8% year-over-year and 8.6% sequentially.

  • Gross margin: 16.5%, up 5.6 percentage points year-over-year and 3.5 points sequentially.

  • Operating expenses: $109.1 million, up 11.4% year-over-year, mainly due to higher labor costs.

  • Net profit attributable to shareholders: $38.6 million, up 385.9% year-over-year.

  • Basic EPS: $0.022, up 340% year-over-year.

  • Annualized ROE: 2.4%, up 2 percentage points year-over-year.

  • Net cash from operating activities: $338.1 million, up 99.3% year-over-year.

  • Capital expenditures: $356.6 million in Q2 2026.

  • Cash and cash equivalents: $4.53 billion as of June 30, 2026.

  • Interest-bearing bank borrowings: $3,567.5 million, down from $3,897.2 million sequentially.

  • Debt ratio: 36.3%, down from 37.9% sequentially.

Outlook and guidance

  • Q3 2026 revenue expected between $770 million and $780 million, with gross margin projected at 16%-18%.

  • Revenue growth in Q3 driven by both ASP (60%) and volume (40%) increases, especially in MCUs and embedded memory.

  • Full ramp-up of Fab 9A expected in Q3, with output impact in Q4 and 2027; Fab 9B to begin ramping in 2027.

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