C.Uyemura & Co (4966) Q2 2026 earnings summary
Event summary combining transcript, slides, and related documents.
Q2 2026 earnings summary
11 May, 2026Executive summary
Semiconductor package substrate plating chemicals saw strong demand, especially for generative AI servers and automotive electronics, driving both sales and segment profit above the previous year’s second quarter.
Revenue for the six months ended September 2025 rose 2.3% year-over-year to ¥41,701 million, with operating profit up 4.9% to ¥9,575 million and net profit attributable to shareholders up 2.0% to ¥6,858 million.
Plating machinery sales slightly declined year-over-year, but higher-value semiconductor wafer plating equipment boosted segment profit.
Plating processing for electronic circuit boards increased, with cost reductions and yield improvements contributing to higher sales and segment profit.
Financial highlights
Consolidated net sales for Q2 were ¥41,701 million, up 2.3% year-over-year and 10.1% above forecast.
Operating income rose to ¥9,575 million, up 4.9% year-over-year and 37.4% above forecast.
Ordinary income was ¥9,642 million, up 33.0% from forecast but down 1.7% year-over-year.
Net income for the period was ¥6,858 million, up 2.0% year-over-year and 30.4% above forecast.
Comprehensive income fell 42.2% year-over-year to ¥5,922 million, reflecting currency translation losses.
Outlook and guidance
Full-year sales forecast revised upward to ¥86,000 million (+4.1% from previous forecast, +2.6% YoY), with operating income expected at ¥19,700 million (+31.2% from previous forecast, +4.6% YoY).
Net income forecast raised to ¥13,500 million (+29.2% from previous forecast, −4.1% YoY).
EPS forecast for the year revised to ¥836.68.
Dividend forecast raised to ¥280 per share for the year.
Strong demand for wafer and package substrate plating chemicals for AI servers expected to continue.
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