Logotype for AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

AT & S Austria Technologie & Systemtechnik (ATS) Investor presentation summary

Event summary combining transcript, slides, and related documents.

Logotype for AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Investor presentation summary

30 Jun, 2026

Strategic positioning and market overview

  • Leading provider of advanced substrates and PCBs, uniquely positioned as the only Western high-end manufacturer in a concentrated ecosystem.

  • Headquarters in Austria with six manufacturing plants across Europe and Asia, supporting global reach.

  • Focused on enabling next-generation digital infrastructure, especially in AI, high-performance computing, and advanced packaging.

  • Strong integration with megatrends such as digitization, robotics, and electrification, driving demand in supply-constrained markets.

  • Unique geographical position and deep integration with tier-1 customers.

Financial performance and outlook

  • FY 2025/26 revenue reached €1.8 billion, up 21% at constant currency, with EBITDA margin at 23.3%.

  • Operating free cash flow turned positive at €236 million, a significant improvement from the previous year.

  • FY 2026/27 guidance targets 45-55% revenue growth and EBITDA margin of 32-37%, with net CAPEX of €1.0–1.2 billion.

  • Net debt/EBITDA expected to remain below 3, supported by a solid financial structure and €912 million in cash and credit lines.

  • Cost-saving and efficiency programs delivered €170 million in sustainable savings in FY 25/26, with an additional €110 million targeted for FY 26/27.

Operational highlights and growth drivers

  • Major investments of €3.5 billion from 2020/21 to 2025/26 have laid the foundation for profitable growth.

  • Strong growth in substrates for AI applications, particularly from the Kulim site, and expansion in Chongqing.

  • Microelectronics segment saw 53% revenue growth, driven by strong demand and improved utilization.

  • Electronics Solutions segment maintained stable margins despite pricing pressures, supported by higher volumes and cost optimization.

  • Diversification of key customers and applications, with significant growth in both PCB and IC substrate segments.

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